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Microsystems Technologies

Module name (EN):
Name of module in study programme. It should be precise and clear.
Microsystems Technologies
Degree programme:
Study Programme with validity of corresponding study regulations containing this module.
Neural Engineering, Master, ASPO 01.04.2020
Module code: NE2103.MST
The exam administration creates a SAP-Submodule-No for every exam type in every module. The SAP-Submodule-No is equal for the same module in different study programs.
Hours per semester week / Teaching method:
The count of hours per week is a combination of lecture (V for German Vorlesung), exercise (U for Übung), practice (P) oder project (PA). For example a course of the form 2V+2U has 2 hours of lecture and 2 hours of exercise per week.
3V+1U (4 hours per week)
ECTS credits:
European Credit Transfer System. Points for successful completion of a course. Each ECTS point represents a workload of 30 hours.
Semester: 1
Mandatory course: yes
Language of instruction:
Written exam

[updated 12.03.2020]
Applicability / Curricular relevance:
All study programs (with year of the version of study regulations) containing the course.

NE2103.MST (P213-0140) Neural Engineering, Master, ASPO 01.04.2020 , semester 1, mandatory course
Workload of student for successfully completing the course. Each ECTS credit represents 30 working hours. These are the combined effort of face-to-face time, post-processing the subject of the lecture, exercises and preparation for the exam.

The total workload is distributed on the semester (01.04.-30.09. during the summer term, 01.10.-31.03. during the winter term).
60 class hours (= 45 clock hours) over a 15-week period.
The total student study time is 120 hours (equivalent to 4 ECTS credits).
There are therefore 75 hours available for class preparation and follow-up work and exam preparation.
Recommended prerequisites (modules):
Recommended as prerequisite for:
Module coordinator:
Prof. Dr. Wenmin Qu
Prof. Dr. Wenmin Qu

[updated 12.03.2020]
Learning outcomes:
Students should have a good understanding of commonly used technologies in microsystems engineering; especially, they should have a good command of the functional principles and associated manufacturing procedures of typical micro components; they can designate the advantages and limitations of the different micro manufacturing techniques and can select suitable solutions for practical applications

[updated 12.03.2020]
Module content:
1. Introduction: markets and applications of Microsystems Technology
2. Overview of microfabrication techonologies
2.1 Lithography
2.2 Thin-film techniques
2.3 Bulk- and surface micromachining
2.4 LIGA technology
3. Main micro fabrication processes
3.1 Materials of microsystems
3.2 Cleanroom technology and behavior in cleanrooms
3.3 Lithography
3.4 Thin-film process (CVD, PVD; Oxidation)
3.5 Doping
3.6 Etching
3.7 Bonding and Packaging  
4. Applications:
4.1 Micro sensors
4.1.1 Temperature sensor
4.1.1 Pressure sensor
4.1.2 Acceleration sensor
4.1.3 Rotation rate sensor
4.1.4 Glucose sensor
4.2 Micro Actuators
4.2.1 Micro channels for mixing purpose
4.2.2 Inkjet printhead
4.2.3 Mirror chips

[updated 12.03.2020]
Teaching methods/Media:
Lectures using PowerPoint presentations incl. video sequences, especially for selected manufacturing processes and components.

[updated 12.03.2020]
Recommended or required reading:
Boussey, Jumana: Microsystems Technology: Fabrication, Test and Reliability, Kogan Page Science, 2003, ISBN 978-1903996478
Francis, Laurent A.; Iniewski, Krzysztof: Novel Advances in Microsystems Technologies and Their Applications, CRC Press, 2017, Reprint, ISBN 978-1138072794
Madou, Marc J.: Fundamentals of Microfabrication, CRC Press, 1997, ISBN 0-8493-9451-1
Menz, Wolfgang; Mohr, Jürgen; Paul, Oliver: Microsystem Technology, Wiley-VCH, 2001, ISBN 978-3527296347

[updated 18.07.2019]
[Sat Apr 20 16:24:43 CEST 2024, CKEY=nemNE2103.MST, BKEY=nem, CID=NE2103.MST, LANGUAGE=en, DATE=20.04.2024]